Cooling Heat Sinks by Natural and Forced Convection in Microelectronic Packages: Numerical Modeling and Experimental Thermal Studies

This paper presents a high precision simulation methodology microelectronic packages with heat sinks, subjected to natural convection or forced convection, that is based on our coupled methodology which is presented in references [1], [2]. The validation of this methodology is performed by comparing...

Full description

Saved in:
Bibliographic Details
Published in2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) pp. 726 - 733
Main Authors Souare, Papa Momar, Kabirou Toure, Mamadou, Foisy, Benoit, Duchesne, Eric, Sylvestre, Julien
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.07.2020
Subjects
Atmospheric modeling
Computational fluid dynamics
Computational heat transfer
Convection
Forced convection
Heat sink
Heat sinks
Mathematical model
Microelectronic packaging
Microelectronics
Natural convection
Numerical models
Still air chamber
Thermal analysis
Thermal conduction
Thermal management
Thermal radiation
Wind tunnel
Online AccessGet full text

Cover

More Information
Summary:This paper presents a high precision simulation methodology microelectronic packages with heat sinks, subjected to natural convection or forced convection, that is based on our coupled methodology which is presented in references [1], [2]. The validation of this methodology is performed by comparing the results of the Computational fluid dynamics (CFD) simulations, the simulation results using empirical relationships and experimental measurements, to demonstrate the high accuracy of our coupled methodology to predict the temperature distribution within a microelectronic package with a finned heat sink cooled by natural convection or forced convection. A summary of the convection coefficients inside the fins and the equivalent thermal resistance of the fins is presented for both heat transfer modes; it shows clearly that the calculation of the heat transfer coefficients by the empirical formulas is greatly overestimated with respect to the coefficients obtained by CFD.
ISSN:2577-0799
DOI:10.1109/ITherm45881.2020.9190633