Training program in electronic passive components education

One of the dynamic developments in electronic components is in passive components. More and more requirements are coming from the end users, the equipment developers. At the same time, new electronic packaging technology requires new component features. These features must be seen from a wide perspe...

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Bibliographic Details
Published in52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) pp. 780 - 786
Main Authors Svasta, P., Golumbeanu, V., Ionescu, C., Codreanu, N.D., Leonescu, D., Vladescu, M., Vuza, D.T.
Format Conference Proceeding
LanguageEnglish
Published Piscataway NJ IEEE 2002
Subjects
Applied sciences
Capacitors
Ceramics
Design. Technologies. Operation analysis. Testing
Educational programs
Electronic components
Electronic equipment
Electronic packaging thermal management
Electronics
Electronics packaging
Exact sciences and technology
Impedance
Integrated circuits
Packaging machines
Resistors
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Learning
Passive component
Electronic component
Electronic packaging
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Summary:One of the dynamic developments in electronic components is in passive components. More and more requirements are coming from the end users, the equipment developers. At the same time, new electronic packaging technology requires new component features. These features must be seen from a wide perspective that includes electrical, mechanical, thermal, technological and other points of view. This huge amount of knowledge must be appropriate for the packaging engineers. In the near future the demand for such specialists will dramatically increase and that is why the university must be able to support their education in undergraduate programs and curricula.
ISBN:9780780374300
0780374304
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2002.1008188