Maintenance processor/time stress measurement device (MP/TSMD) use for failure trend analysis

• Published in: Annual Reliability and Maintainability Symposium 1992 Proceedings pp. 228 - 238
• Main Authors: Broadwater, S.P., Oblak, T.A., Popyack, L.J.
• Format: Conference Proceeding Journal Article
• Language: English
• Published: IEEE 01.01.1992
• Subjects: Automatic testing; Failure analysis; Fault detection; Maintenance; Microprocessors; Radar; Stress measurement; System testing; Vehicle detection; Weapons
• DOI: 10.1109/ARMS.1992.187827
• ISBN: 9780780305212; 0780305213

The authors define the use of advanced built-in-test-equipment technology to reduce or eliminate reliability and maintainability problems associated with on-equipment fault detection and isolation. System supportability requirements for both mature and new systems defined the need for a subsystem level device to perform built-in-test (BIT) functions in addition to capturing environmental stress data. To satisfy these requirements, a microprocessor-based maintenance processor/time stress measurement device (MP/TSMD) system was developed and field-tested. During 1992, the MP/TSMD will be operationally used to identify failure trends in the B-1B offensive radar system and to provide data for environmental stress simulation at the depot. The authors provide a technical description of the MP/TSMD and the fault logging system designed around it.< >