Systematic Study on Failure Information of Thick Film Hybrid Integrated Circuit

• Published in: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) pp. 1 - 5
• Main Authors: xiaowen, Zhang, hongjie, Lv, xing, Liu
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.07.2019
• Subjects: failure mechanism; failure mode; HIC reliability; statistical analysis
• ISSN: 1946-1550
• DOI: 10.1109/IPFA47161.2019.8984764

Through the statistical analysis of failures of components and interconnect in thick film HIC(Hybrid Integrated Circuit), the failure mode and failure mechanism affecting the reliability of HIC has been studied. Based on the analysis of the factors which affecting the reliability of thick film HIC, the failure mode and failure mechanism were summarized. 4 cases of failure analysis of thick film HIC were presented, and the typical failure modes and failure mechanisms of the thick film HIC were analyzed, which support the summary. Finally, based on the failures analysis reports accumulated over many years, the statistical analysis of the failure parts has been conducted to study the main factor which dominate the reliability of thick film HIC. It is indicating that the failure of components is the main cause of the failure of thick film HIC, followed by the failure of wire bonding and internal interconnection. In addition, some of the failures are caused by external factors. Since the failure of active devices is the main failure mode of thick film HIC, the selection of highly reliable components is an effective way to improve HIC reliability. Secondly, if necessary, optimize the soldering process to improve the reliability of the components in thick film HIC.