Electronic box-level reliability assessment using computer modeling and simulation

• Published in: Annual Reliability and Maintainability Symposium 1995 Proceedings pp. 49 - 53
• Main Authors: Chiang, A.C., Barker, D.B., Krolewski, J.G., Cushing, M.J.
• Format: Conference Proceeding Journal Article
• Language: English
• Published: IEEE 1995
• Subjects: Assembly systems; Circuits; Computer simulation; Electric shock; Electronics packaging; Filters; Military computing; Software performance; Software tools; Temperature
• ISBN: 9780780324701; 0780324706
• ISSN: 0149-144X; 2577-0993
• DOI: 10.1109/RAMS.1995.513223

Modern commercial and military systems rely heavily on large quantities of electronics with high packaging densities. System readiness is strongly dependent upon the reliability of each electronic subsystem, its associate circuit card assemblies and individual components. Currently missing in electronic system reliability assessment is computer simulation from the circuit card level upward in the electronic system. The performance of the electronic box directly effects the reliability of the electronics inside the box since the box filters many environmental loads such as shock and vibration, temperature change, etc. A research effort has been initiated by the CALCE Electronic Packaging Research Center, sponsored by the Defense Modeling and Simulation Office (DMSO), to develop a software program to perform electronic box-level reliability assessment. In addition to the box level assessment, more reliable dynamic load information will be available from the program to be transmitted downward to the PWB and component level for further reliability assessment. A description is presented in this paper of the software program that has been developed. Further improvement of the software tool will continue to increase its robustness and sophistication by incorporating users suggestions.