Warpage of Compression Molded SiP Strips

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing parameters and processes [1], [2]. Previous research on the warpage primarily focused only on the SiP...

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Bibliographic Details
Published in2021 IEEE 71st Electronic Components and Technology Conference (ECTC) pp. 2134 - 2139
Main Authors Ouyang, Eric, Jeong, Yonghyuk, Kim, JaeMyong, Kim, JaePil, Kwon, OhYoung, Liu, Michael, Lin, Susan, Wang, Jenn An, Yang, Anthony, Yang, Eric
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2021
Subjects
Compression
Data models
Manufacturing processes
molding
Numerical models
Predictive models
SiP
Strips
Substrates
Transfer molding
warpage
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Summary:System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing parameters and processes [1], [2]. Previous research on the warpage primarily focused only on the SiP module unit, while the consideration of strip warpage as a function of manufacturing processes has not typically been studied theoretically and experimentally. In this paper, the impact of manufacturing processes, mainly the compression molding process, on the warpage is investigated experimentally and numerically. To better understand the advantages of compression molding, we will also compare compression molding with transfer molding using a computer simulation. The paper will point out the pros and cons of these two different manufacturing processes.
ISSN:2377-5726
DOI:10.1109/ECTC32696.2021.00335