Implementing a 32 x 32 2D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array Incorporating Silicon-Through-Glass-Via (Si-TGV) Interconnects

A 2D transducer array is an essential component of an ultrasound system with 3D beamforming capability. CMUT technology has enabled the possibility of developing complex transducer geometries for different applications. In this work, we demonstrate the fabrication of a 32x32-element 2D CMUT array on...

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Bibliographic Details
Published in2020 IEEE International Ultrasonics Symposium (IUS) pp. 1 - 3
Main Authors Adelegan, Oluwafemi J., Coutant, Zachary A., Minhaj, Tamzid Ibn, Yamaner, F. Yalcin, Oralkan, Omer
Format Conference Proceeding
LanguageEnglish
Published IEEE 07.09.2020
Subjects
2D Arrays
CMUT
Fabrication
Glass
Glass substrate
Silicon
Silicon through-glass-vias (Si- TGV)
Substrates
Two dimensional displays
Ultrasonic transducer arrays
Ultrasonic variables measurement
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Summary:A 2D transducer array is an essential component of an ultrasound system with 3D beamforming capability. CMUT technology has enabled the possibility of developing complex transducer geometries for different applications. In this work, we demonstrate the fabrication of a 32x32-element 2D CMUT array on a glass substrate using silicon through-glass-via interconnects. Introducing silicon vias in glass substrate enables improvement in fabrication yield. Preliminary results show the successful demonstration of the proposed fabrication process. The fabricated vacuum-sealed devices show a resonant frequency of 4.7 MHz in air.
ISSN:1948-5727
DOI:10.1109/IUS46767.2020.9251615