Ternary Sense Amplifier Design for Ternary SRAM
This paper proposes the design of a Ternary Sense Amplifier (T-SA) using Samsung-28nm fabrication process that can sense three states, which are VDD, VDD/2, and GND. The T-SA has a ternary inverter back-to-back structure, and is configured as a latch type. The trade-off relationship between sensing...
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Published in | 2021 18th International SoC Design Conference (ISOCC) pp. 151 - 152 |
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Main Authors | , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
06.10.2021
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Subjects | |
Online Access | Get full text |
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Summary: | This paper proposes the design of a Ternary Sense Amplifier (T-SA) using Samsung-28nm fabrication process that can sense three states, which are VDD, VDD/2, and GND. The T-SA has a ternary inverter back-to-back structure, and is configured as a latch type. The trade-off relationship between sensing margin and sensing speed was analyzed according to the size. The T-SA may enable the realization of a memory array with ternary logic in a Multi-Valued Logic system. |
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DOI: | 10.1109/ISOCC53507.2021.9613911 |