Low cost uncooled mini-DIL module for pump laser

• Published in: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) pp. 811 - 814
• Main Authors: Jicheng Yang, Darveaux, R., Greenwood, J.
• Format: Conference Proceeding
• Language: English
• Published: Piscataway NJ IEEE 2002
• Subjects: Applied sciences; Circuit properties; Costs; Design. Technologies. Operation analysis. Testing; Electric, optical and optoelectronic circuits; Electronics; Electronics packaging; Exact sciences and technology; Fiber lasers; Fundamental areas of phenomenology (including applications); Integrated circuits; Integrated optics. Optical fibers and wave guides; Laser excitation; Lasers; Optical and optoelectronic circuits; Optical coupling; Optical design; Optical fiber devices; Optics; Other multijunction devices. Power transistors. Thyristors; Physics; Power lasers; Pump lasers; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Semiconductor lasers; laser diodes; Temperature; Performance evaluation; Creep; Fiber laser; Thermal cycle; Durability; Optical coupling; Power electronics; Injection laser; Mismatching; Laser welding; Optimization; Optimal design; Solid state laser; Integrated circuit bonding; Thermal expansion; Active system; Soldered joint; Vacuum chamber; Automatic system; Optical flow; Reflow soldering
• ISBN: 9780780374300; 0780374304
• ISSN: 0569-5503; 2377-5726
• DOI: 10.1109/ECTC.2002.1008193

This paper describes a low cost uncooled, 8 pin mini-dual inline (DIL) module for a medium power 980 nm pump laser. In this low cost pump laser module, an innovative approach was adopted on the module design. This design allows the use of conventional pick-and place equipment to load all the components (except the fiber pigtail) in one pass. These components are then reflowed in a vacuum chamber to achieve the attachment in one step without the need for any flux. The most crucial and time-consuming assembly step is the fiber-to-laser diode coupling and attachment. An automatic active alignment system was used to achieve the most efficient coupling between laser diode and fiber. Laser welding was then utilized to hold that coupling position. This pump laser module has achieved coupling efficiencies of 80% at optimum alignment. The module is able to maintain the coupling efficiencies within 10% peak coupling efficiency in its operation temperature range of -5 to 70/spl deg/C. The pump laser module is under qualification to the requirements of Telcordia-468, including temperature cycling, high temperature operating life, vibration and shock. This paper covers the module design, process flow, optical coupling simulation, thermomechanical simulation and design optimization, coupling efficiency measurement and its change with environmental conditions.