High Volume Semiconductor Manufacturing Using Nanoimprint Lithography

Any new lithographic technology to be introduced into manufacturing must deliver either a performance advantage or a cost advantage. Key technical attributes include alignment, overlay and throughput. In this work, we review progress on pattern capability, throughput, mask life and overlay.

Saved in:
Bibliographic Details
Published in2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) pp. 1 - 4
Main Authors Takabayashi, Yukio, Iwanaga, Takehiko, Hiura, Mitsuru, Morohoshi, Hiroshi, Hayashi, Tatsuya, Komaki, Takamitsu, Morimoto, Osamu, Sakai, Keita, Zhang, Wei, Cherala, Anshuman, Im, Se-Hyuk, Meissl, Mario, Choi, Jin
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.04.2020
Subjects
Online AccessGet full text

Cover

Loading…
Abstract Any new lithographic technology to be introduced into manufacturing must deliver either a performance advantage or a cost advantage. Key technical attributes include alignment, overlay and throughput. In this work, we review progress on pattern capability, throughput, mask life and overlay.
AbstractList Any new lithographic technology to be introduced into manufacturing must deliver either a performance advantage or a cost advantage. Key technical attributes include alignment, overlay and throughput. In this work, we review progress on pattern capability, throughput, mask life and overlay.
Author Cherala, Anshuman
Hayashi, Tatsuya
Komaki, Takamitsu
Morimoto, Osamu
Choi, Jin
Morohoshi, Hiroshi
Takabayashi, Yukio
Zhang, Wei
Im, Se-Hyuk
Meissl, Mario
Hiura, Mitsuru
Iwanaga, Takehiko
Sakai, Keita
Author_xml – sequence: 1
  givenname: Yukio
  surname: Takabayashi
  fullname: Takabayashi, Yukio
  organization: Canon Inc.,20-2, Kiyohara-Kogyodanchi, Utsunomiya-shi, Tochigi,Japan,321-3292
– sequence: 2
  givenname: Takehiko
  surname: Iwanaga
  fullname: Iwanaga, Takehiko
  organization: Canon Inc.,20-2, Kiyohara-Kogyodanchi, Utsunomiya-shi, Tochigi,Japan,321-3292
– sequence: 3
  givenname: Mitsuru
  surname: Hiura
  fullname: Hiura, Mitsuru
  organization: Canon Inc.,20-2, Kiyohara-Kogyodanchi, Utsunomiya-shi, Tochigi,Japan,321-3292
– sequence: 4
  givenname: Hiroshi
  surname: Morohoshi
  fullname: Morohoshi, Hiroshi
  organization: Canon Inc.,20-2, Kiyohara-Kogyodanchi, Utsunomiya-shi, Tochigi,Japan,321-3292
– sequence: 5
  givenname: Tatsuya
  surname: Hayashi
  fullname: Hayashi, Tatsuya
  organization: Canon Inc.,20-2, Kiyohara-Kogyodanchi, Utsunomiya-shi, Tochigi,Japan,321-3292
– sequence: 6
  givenname: Takamitsu
  surname: Komaki
  fullname: Komaki, Takamitsu
  organization: Canon Inc.,20-2, Kiyohara-Kogyodanchi, Utsunomiya-shi, Tochigi,Japan,321-3292
– sequence: 7
  givenname: Osamu
  surname: Morimoto
  fullname: Morimoto, Osamu
  organization: Canon Inc.,20-2, Kiyohara-Kogyodanchi, Utsunomiya-shi, Tochigi,Japan,321-3292
– sequence: 8
  givenname: Keita
  surname: Sakai
  fullname: Sakai, Keita
  organization: Canon Inc.,20-2, Kiyohara-Kogyodanchi, Utsunomiya-shi, Tochigi,Japan,321-3292
– sequence: 9
  givenname: Wei
  surname: Zhang
  fullname: Zhang, Wei
  organization: Canon Nanotechnologies Inc.,1807 West Braker Lane, Bldg. C-300, Austin,TX,USA,78758
– sequence: 10
  givenname: Anshuman
  surname: Cherala
  fullname: Cherala, Anshuman
  organization: Canon Nanotechnologies Inc.,1807 West Braker Lane, Bldg. C-300, Austin,TX,USA,78758
– sequence: 11
  givenname: Se-Hyuk
  surname: Im
  fullname: Im, Se-Hyuk
  organization: Canon Nanotechnologies Inc.,1807 West Braker Lane, Bldg. C-300, Austin,TX,USA,78758
– sequence: 12
  givenname: Mario
  surname: Meissl
  fullname: Meissl, Mario
  organization: Canon Nanotechnologies Inc.,1807 West Braker Lane, Bldg. C-300, Austin,TX,USA,78758
– sequence: 13
  givenname: Jin
  surname: Choi
  fullname: Choi, Jin
  organization: Canon Nanotechnologies Inc.,1807 West Braker Lane, Bldg. C-300, Austin,TX,USA,78758
BookMark eNotj8tOwzAURI0EC1r4AiSUH0iwr-PXEpVAkVJY0LKtXOc6sdTYVZos-vcUtZsZ6SxGZ2bkNqaIhDwzWjBGzUv1tl6VShoogAItDGNKG7ghM6ZAMxDcsHtSLUPbZb9pP_WY_WAfXIrN5MY0ZCsbJ2_dOA0httnm-J9fNqbQH85kzOowdqkd7KE7PZA7b_dHfLz2nGzeq_VimdffH5-L1zoPQPmYl8xxpMpqMEYoYahn2lDgzEoU2IgdVU56r0BCowVVpeMavOEgcQfSWz4nT5fdgIjbs0Zvh9P2-oz_ASJvSKs
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1109/EDTM47692.2020.9117892
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume
IEEE Xplore All Conference Proceedings
IEEE Electronic Library (IEL)
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Xplore
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
EISBN 1728125391
9781728125398
EndPage 4
ExternalDocumentID 9117892
Genre orig-research
GroupedDBID 6IE
6IL
CBEJK
RIE
RIL
ID FETCH-LOGICAL-i203t-41c3e07a829957590f1890231a6e5ed5b07c6ff7262d85074c382f9326eb26fa3
IEDL.DBID RIE
IngestDate Thu Jun 29 18:37:46 EDT 2023
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-i203t-41c3e07a829957590f1890231a6e5ed5b07c6ff7262d85074c382f9326eb26fa3
PageCount 4
ParticipantIDs ieee_primary_9117892
PublicationCentury 2000
PublicationDate 2020-April
PublicationDateYYYYMMDD 2020-04-01
PublicationDate_xml – month: 04
  year: 2020
  text: 2020-April
PublicationDecade 2020
PublicationTitle 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
PublicationTitleAbbrev EDTM
PublicationYear 2020
Publisher IEEE
Publisher_xml – name: IEEE
Score 1.7760061
Snippet Any new lithographic technology to be introduced into manufacturing must deliver either a performance advantage or a cost advantage. Key technical attributes...
SourceID ieee
SourceType Publisher
StartPage 1
SubjectTerms Actuators
Bending
Costs
Distortion
HODC
Manufacturing
mask life
nanoimprint lithography
NIL
overlay
Random access memory
resolution
Throughput
Title High Volume Semiconductor Manufacturing Using Nanoimprint Lithography
URI https://ieeexplore.ieee.org/document/9117892
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3PS8MwFA5zJ08qm_ibHDyaLk3aJj3rZIgVwU12G0mT4BBbGe3Fv968tE4UD95CCGl-0Pdeku_7HkKXqRGpLhUlsdGOJFJxogTjhFshjVOxiwM2p3jIZovkbpkuB-hqy4Wx1gbwmY2gGN7yTV22cFU28T-mkLk3uDuSso6r1ZN-Y5pPpjfzIhFZDvQqRqO-8Y-sKcFp3O6h4utzHVbkNWobHZUfv5QY_zuefTT-pufhx63jOUADW43QFBAb-DkYG_wEkPe6Ai3XeoMLVbVAYAiMRBxAAthb1Xr9Brd6Db5fNy-9cvUYLW6n8-sZ6XMkkDWjvCFJXHJLhZLerUCuTeoXNwdNN5XZ1JpUU1FmzgmWMSN97JeUXDIHQZs_UmdO8UM0rOrKHiEML4rOcJOyRCZGuNz6YEHp3DIVa9_LMRrBEqzeOxmMVT_7k7-rT9EubEMHcjlDw2bT2nPvvxt9ETbuExLgnLI
link.rule.ids 310,311,786,790,795,796,802,27956,55107
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3PT8MgGCXLPOhJzWb8LQePtqNACz3rlqnrYuJmdlugQFzMWrO0F_96gdYZjQdvpCG0hfR7X-G99wFwHSsWy1ygIFLSBJQLEgiGSUA048qIyESem5NNk_GcPiziRQfcbLUwWmtPPtOha_qzfFXmtdsqG9gPk_HUBtwdi_OINWqtVvYboXQwvJtllCWpE1hhFLbdf9RN8bAx2gfZ1w0btshbWFcyzD9-eTH-94kOQP9boAefttBzCDq66IGh42zAFx9u4LMjvZeFc3MtNzATRe0kDF6TCD1NANq4Wq7Wbl-vgpNV9dp6V_fBfDSc3Y6DtkpCsMKIVAGNcqIRE9wCi6u2iez0ps7VTSQ61iqWiOWJMQwnWHGb_dGccGxc2mZ_qhMjyBHoFmWhjwF0Z4pGERVjyqliJtU2XRAy1VhE0o5yAnpuCpbvjRHGsn37078vX4Hd8SybLCf308czsOeWpKG8nINutan1hUXzSl76RfwEhXOgBg
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2020+4th+IEEE+Electron+Devices+Technology+%26+Manufacturing+Conference+%28EDTM%29&rft.atitle=High+Volume+Semiconductor+Manufacturing+Using+Nanoimprint+Lithography&rft.au=Takabayashi%2C+Yukio&rft.au=Iwanaga%2C+Takehiko&rft.au=Hiura%2C+Mitsuru&rft.au=Morohoshi%2C+Hiroshi&rft.date=2020-04-01&rft.pub=IEEE&rft.spage=1&rft.epage=4&rft_id=info:doi/10.1109%2FEDTM47692.2020.9117892&rft.externalDocID=9117892