High Volume Semiconductor Manufacturing Using Nanoimprint Lithography
Any new lithographic technology to be introduced into manufacturing must deliver either a performance advantage or a cost advantage. Key technical attributes include alignment, overlay and throughput. In this work, we review progress on pattern capability, throughput, mask life and overlay.
Saved in:
Published in | 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) pp. 1 - 4 |
---|---|
Main Authors | , , , , , , , , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.04.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Any new lithographic technology to be introduced into manufacturing must deliver either a performance advantage or a cost advantage. Key technical attributes include alignment, overlay and throughput. In this work, we review progress on pattern capability, throughput, mask life and overlay. |
---|---|
DOI: | 10.1109/EDTM47692.2020.9117892 |