High Volume Semiconductor Manufacturing Using Nanoimprint Lithography

Any new lithographic technology to be introduced into manufacturing must deliver either a performance advantage or a cost advantage. Key technical attributes include alignment, overlay and throughput. In this work, we review progress on pattern capability, throughput, mask life and overlay.

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Bibliographic Details
Published in2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) pp. 1 - 4
Main Authors Takabayashi, Yukio, Iwanaga, Takehiko, Hiura, Mitsuru, Morohoshi, Hiroshi, Hayashi, Tatsuya, Komaki, Takamitsu, Morimoto, Osamu, Sakai, Keita, Zhang, Wei, Cherala, Anshuman, Im, Se-Hyuk, Meissl, Mario, Choi, Jin
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.04.2020
Subjects
Actuators
Bending
Costs
Distortion
HODC
Manufacturing
mask life
nanoimprint lithography
NIL
overlay
Random access memory
resolution
Throughput
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Summary:Any new lithographic technology to be introduced into manufacturing must deliver either a performance advantage or a cost advantage. Key technical attributes include alignment, overlay and throughput. In this work, we review progress on pattern capability, throughput, mask life and overlay.
DOI:10.1109/EDTM47692.2020.9117892