High Temperature Design of a GaN Based Modular Integrated Drive with Natural Cooling Using Metal Clad PCBs
This paper proposes a high temperature design of an integrated three phase inverter using direct drive GaN HEMT devices and metal clad PCBs (MCPCB). The inverter features a modular design approach, utilizing a 600 V direct drive GaN device with integrated overcurrent and overtemperature protection....
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Published in | 2019 IEEE Energy Conversion Congress and Exposition (ECCE) pp. 4012 - 4017 |
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Main Authors | , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.09.2019
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Subjects | |
Online Access | Get full text |
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