High Temperature Design of a GaN Based Modular Integrated Drive with Natural Cooling Using Metal Clad PCBs

• Published in: 2019 IEEE Energy Conversion Congress and Exposition (ECCE) pp. 4012 - 4017
• Main Authors: Abdullah, Yousef, Li, Xiao, Wang, Ke, Wang, Jin, Liu, Liming, Bala, Sandeep
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.09.2019
• Subjects: Cooling; drive; Gallium nitride; GaN; Heating systems; IMD; integrated; inverter; Inverters; motor; PWM; Temperature measurement; Thermal resistance

This paper proposes a high temperature design of an integrated three phase inverter using direct drive GaN HEMT devices and metal clad PCBs (MCPCB). The inverter features a modular design approach, utilizing a 600 V direct drive GaN device with integrated overcurrent and overtemperature protection....