High Temperature Design of a GaN Based Modular Integrated Drive with Natural Cooling Using Metal Clad PCBs

This paper proposes a high temperature design of an integrated three phase inverter using direct drive GaN HEMT devices and metal clad PCBs (MCPCB). The inverter features a modular design approach, utilizing a 600 V direct drive GaN device with integrated overcurrent and overtemperature protection....

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Bibliographic Details
Published in2019 IEEE Energy Conversion Congress and Exposition (ECCE) pp. 4012 - 4017
Main Authors Abdullah, Yousef, Li, Xiao, Wang, Ke, Wang, Jin, Liu, Liming, Bala, Sandeep
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2019
Subjects
Cooling
drive
Gallium nitride
GaN
Heating systems
IMD
integrated
inverter
Inverters
motor
PWM
Temperature measurement
Thermal resistance
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Summary:This paper proposes a high temperature design of an integrated three phase inverter using direct drive GaN HEMT devices and metal clad PCBs (MCPCB). The inverter features a modular design approach, utilizing a 600 V direct drive GaN device with integrated overcurrent and overtemperature protection. Aluminum based PCBs with high thermal conductivity are also used to achieve a natural cooling solution with only air convection at an ambient temperature of up to 95°C Thermal . simulations are performed to verify the thermal performance of the system. The inverter was built and experimentally tested in a thermal chamber to verify the drive performance at high temperatures. The design achieves a continues power of 1.8 kW. Peak efficiencies of 99.8% and 99.45% are achieved at room temperature and 95°C respectively.
ISSN:2329-3748
DOI:10.1109/ECCE.2019.8912701