A high density, high performance MCM-D/C package: a design, electrical, and process perspective

This paper describes a state-of-the-art seven chip MCM-D/C package currently under production for use as a processor module for the high end of IBM's AS/400 Advanced Series with PowerPC technology. Physical design, process, and electrical design (characterization) is described, and trade-offs m...

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Bibliographic Details
Published in1996 Proceedings 46th Electronic Components and Technology Conference pp. 821 - 828
Main Authors Ellsworth, M.J., Hamel, H., Perfecto, E.D., Wassick, T.
Format Conference Proceeding Journal Article
LanguageEnglish
Published IEEE 1996
Subjects
Application specific integrated circuits
Capacitors
Electronics packaging
Microelectronics
Microprocessors
Process design
Production
Silicon
Transistors
Wiring
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Summary:This paper describes a state-of-the-art seven chip MCM-D/C package currently under production for use as a processor module for the high end of IBM's AS/400 Advanced Series with PowerPC technology. Physical design, process, and electrical design (characterization) is described, and trade-offs made between them are discussed.
Bibliography:SourceType-Scholarly Journals-2
ObjectType-Feature-2
ObjectType-Conference Paper-1
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SourceType-Conference Papers & Proceedings-1
ObjectType-Article-3
ISBN:9780780332867
0780332865
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.1996.550503