RF Devices Integrated by Fan-Out and System-In-Package Technology

Higher performance and smaller form factor are always the critical subjects for mobile device in recent years. To meet this demand, System-In-Package (SiP) has become a certain path for innovation and an unstoppable trend for decade. In this study, the benefits of evolving SiP with organic substrate...

Full description

Saved in:
Bibliographic Details
Published inProceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) pp. 1 - 4
Main Authors Kung, Cheng-Yuan, Lin, Hung-Yi, Kuo, Chin-Cheng, Wu, Cheng-Syuan, Chen, Yu-Ting, Hsieh, Meng-Wei, Hsieh, Yu-Chang, Lee, Pao-Nan
Format Conference Proceeding
LanguageEnglish
Published IEEE 26.10.2022
Subjects
Internet of Things
Low earth orbit satellites
Manufacturing
Performance evaluation
Radio frequency
System-in-package
Technological innovation
Online AccessGet full text
ISSN2150-5942
DOI10.1109/IMPACT56280.2022.9966715

Cover

More Information
Summary:Higher performance and smaller form factor are always the critical subjects for mobile device in recent years. To meet this demand, System-In-Package (SiP) has become a certain path for innovation and an unstoppable trend for decade. In this study, the benefits of evolving SiP with organic substrate to Fan-Out SiP (FOSiP) for new generation mobile RF module with higher performance and smaller form factor has been illustrated. A designed and manufactured FOSiP module with 6 RF devices integrated by several core features and building blocks would be demonstrated, including chip-last RDL manufacturing, carrier system, wafer level assembly and shielding sputtering.
ISSN:2150-5942
DOI:10.1109/IMPACT56280.2022.9966715