The latest advances in industrial IGBT module technology
More than ten years have elapsed since IGBT modules first emerged as the preferred power semiconductor device for a wide range of industrial applications. During this time IGBT chip and module packaging technology has evolved through multiple generations each with incremental improvements in perform...
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Published in | Nineteenth Annual IEEE Applied Power Electronics Conference and Exposition, 2004. APEC '04 Vol. 1; pp. 235 - 240 Vol.1 |
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Main Authors | , |
Format | Conference Proceeding |
Language | English |
Published |
Piscataway NJ
IEEE
2004
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Subjects | |
Online Access | Get full text |
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Summary: | More than ten years have elapsed since IGBT modules first emerged as the preferred power semiconductor device for a wide range of industrial applications. During this time IGBT chip and module packaging technology has evolved through multiple generations each with incremental improvements in performance and reliability. At the same time optimized processing techniques and improved yields have reduced the cost of chip manufacturing. As a result, there are often attractive opportunities to upgrade the performance of industrial power conversion equipment while simultaneously reducing cost This paper will summarize the latest advances in IGBT technology and the implications for future applications. |
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ISBN: | 0780382692 9780780382695 |
DOI: | 10.1109/APEC.2004.1295815 |