Finite Element Model in LTspice of a Distributed RC-Structure Fractional-Order Capacitor Device
Fractional-order capacitors can potentially be fabricated using MOS technologies taking advantage of their distributed resistive-capacitive structure. However, there are limited models to simulate the characteristics of these designs. In this work, an equivalent circuit model to represent a finite-e...
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Published in | Proceedings of IEEE Southeastcon pp. 1494 - 1500 |
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Main Authors | , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
22.03.2025
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Subjects | |
Online Access | Get full text |
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Summary: | Fractional-order capacitors can potentially be fabricated using MOS technologies taking advantage of their distributed resistive-capacitive structure. However, there are limited models to simulate the characteristics of these designs. In this work, an equivalent circuit model to represent a finite-element of a MOS structure is used to assemble a hierarchical model of a complete design in LTspice. This equivalent circuit model is validated (for designs with phases of -77°, -74°, -58°, and -53° with a maximum of ±2° tolerance) against previously established matrix model representations. Using this validated model varying gate length connections (from 100% to 6.25%) caused deviations less than 0.25° supporting that this characteristic of MOS technologies is not likely to have a significant effect on fabricated designs. |
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ISSN: | 1558-058X |
DOI: | 10.1109/SoutheastCon56624.2025.10971518 |