The New Roles of Substrates in the Packaging Technologies for Systems

There are plenty of new challenges facing the whole Microelectronic Industry in the coming years, and the great majority of those challenges will implicate the roles of packaging and substrates in the overall System's performance. While is it difficult to see the future without the use of subst...

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Bibliographic Details
Published inProceedings of the ... IEEE Conference on Nanotechnology pp. 475 - 478
Main Author Oggioni, Stefano Sergio
Format Conference Proceeding
LanguageEnglish
Published IEEE 08.07.2024
Subjects
Copper
Packaging
Power system management
Semiconductor devices
System performance
Transforms
Wiring
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ISSN1944-9380
DOI10.1109/NANO61778.2024.10628853

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Summary:There are plenty of new challenges facing the whole Microelectronic Industry in the coming years, and the great majority of those challenges will implicate the roles of packaging and substrates in the overall System's performance. While is it difficult to see the future without the use of substrates, it is acknowledged the fact that organic substrates have to transform their role, and their contribution in serving the over growing complexity of interactions between computational units, data storage, and communication. It is important to understand what kind of substrate will have the capabilities to do that. This paper highlights some of the key areas undergoing development. The R&D goal is to identify new approaches capable of expanding the desired level of contributions in the Systems' performance, with the construction of improved substrates. With that, there is a clear understanding that in the coming years for the organic substrates, the challenge has just started.
ISSN:1944-9380
DOI:10.1109/NANO61778.2024.10628853