Influence of TVS Properties and Printed Circuit Board Design on System Level ESD Robustness for USB-C SuperSpeed data lines

A USB-C SuperSpeed application is reproduced on custom-made printed circuit boards. The influence of the properties of discrete TVS devices and the board layout on the peak voltage at the input inside the IC and the maximum IC current is investigated by means of (VF-)TLP measurements. SEED simulatio...

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Bibliographic Details
Published in2024 46th Annual EOS/ESD Symposium (EOS/ESD) Vol. 46; pp. 1 - 10
Main Authors Holland, Steffen, Lotfi, Nima, Pilaski, Martin, Laue, Burkhard, Seider, Stefan
Format Conference Proceeding
LanguageEnglish
Published EOS/ESD Association, Inc 16.09.2024
Subjects
Current measurement
Electrostatic discharges
Guidelines
Integrated circuit modeling
Layout
Printed circuits
Robustness
Voltage measurement
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DOI10.23919/EOS/ESD61719.2024.10702133

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Summary:A USB-C SuperSpeed application is reproduced on custom-made printed circuit boards. The influence of the properties of discrete TVS devices and the board layout on the peak voltage at the input inside the IC and the maximum IC current is investigated by means of (VF-)TLP measurements. SEED simulations are compared with the experimental results. Guidelines for an optimal system level ESD protection for the SuperSpeed data lines of this application are presented.
DOI:10.23919/EOS/ESD61719.2024.10702133