An Efficient and Cost-effective Method to Detect and Analyze ESD CDM Risks in Designs
One of the main causes of ESD failure, the Charged-Device-Model (CDM) current can cause a voltage build-up across Gate-Source junction of receiver MOS resulting in breakdown. An efficient and cost-effective solution is proposed to identify CDM risks in designs and further analyze the identified risk...
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Published in | 2024 46th Annual EOS/ESD Symposium (EOS/ESD) Vol. 46; pp. 1 - 8 |
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Main Authors | , , , |
Format | Conference Proceeding |
Language | English |
Published |
EOS/ESD Association, Inc
16.09.2024
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Subjects | |
Online Access | Get full text |
DOI | 10.23919/EOS/ESD61719.2024.10702132 |
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Summary: | One of the main causes of ESD failure, the Charged-Device-Model (CDM) current can cause a voltage build-up across Gate-Source junction of receiver MOS resulting in breakdown. An efficient and cost-effective solution is proposed to identify CDM risks in designs and further analyze the identified risks considering the full context of the design in Bulk-Silicon processes. First, simple risk topologies are used for recognition through a pattern identification engine. Those are then augmented with various risk analysis capabilities, to only highlight real risks, weeding out false violations. |
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DOI: | 10.23919/EOS/ESD61719.2024.10702132 |