ESD dynamic methodology for diagnosis and predictive simulation of HBM/CDM events

A comprehensive ESD dynamic methodology is developed for failure diagnosis and predictive simulation of improvements. This methodology focuses on dynamic analysis including modeling of die-level metal grid, substrate grid and well-diode, package effective capacitance, and pogo pin. Real HBM and CDM...

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Bibliographic Details
Published inElectrical Overstress / Electrostatic Discharge Symposium Proceedings 2012 pp. 1 - 9
Main Authors Ting-Sheng Ku, Jau-Wen Chen, Kokai, G., Chang, N., Shen Lin, Yu Liu, Ying-Shiun Li, Bo Hu
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2012
Subjects
Clamps
Electrostatic discharges
Fingers
Junctions
Metals
Stress
Substrates
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Summary:A comprehensive ESD dynamic methodology is developed for failure diagnosis and predictive simulation of improvements. This methodology focuses on dynamic analysis including modeling of die-level metal grid, substrate grid and well-diode, package effective capacitance, and pogo pin. Real HBM and CDM application examples are illustrated.
ISBN:1467314676
9781467314671
ISSN:0739-5159
2164-9340