Experimental study on the effect of reflow soldering temperature profile on the solder joint shape

In this paper, Surface mount experiment of Sn-Pb and Lead-Free solder joints under different thermal reflow profile was aimed at statistical analysis of the reflowed cross-section contour and shape parameters (height, diameter and contact angle). The results as follows: Reflowed solder joints was a...

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Bibliographic Details
Published in2010 11th International Conference on Electronic Packaging Technology and High Density Packaging pp. 1128 - 1131
Main Authors Bo Wang, Xuexia Yang, Yu Zhang, Xuefeng Shu
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2010
Subjects
Copper
Heating
Materials
Reflow soldering
Shape
Temperature
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ISBN9781424481408
1424481406
DOI10.1109/ICEPT.2010.5582741

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Summary:In this paper, Surface mount experiment of Sn-Pb and Lead-Free solder joints under different thermal reflow profile was aimed at statistical analysis of the reflowed cross-section contour and shape parameters (height, diameter and contact angle). The results as follows: Reflowed solder joints was a pot-shaped body which the top pad is slightly smaller than the bottom pad, and the maximum diameter of solder joints in the side was under the central position; Solder joint shapes obtained from different thermal reflow profiles have greatly differences; The smaller heating factors, the higher height and the smaller diameter and contact angle of solder joint formed by welding.
ISBN:9781424481408
1424481406
DOI:10.1109/ICEPT.2010.5582741