The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads

In this paper, we produce a layer of (111) uni-directional Cu by electroplating. The SnAg 2.3 was used as solder materials. The orientations relationship between uni-directional Cu and Cu 6 Sn 5 were examined. Also, the effect of quality of uni-directional Cu on the orientation of Cu 6 Sn 5 was disc...

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Published in2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) pp. 90 - 93
Main Authors Han-wen Lin, Jia-ling Lu, Chen-min Liu, Chih Chen, King-ning Tu, Delphic Chen, Jui-Chao Kuo
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2012
Subjects
Copper
Image color analysis
Intermetallic
Joints
Soldering
Tin
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Summary:In this paper, we produce a layer of (111) uni-directional Cu by electroplating. The SnAg 2.3 was used as solder materials. The orientations relationship between uni-directional Cu and Cu 6 Sn 5 were examined. Also, the effect of quality of uni-directional Cu on the orientation of Cu 6 Sn 5 was discussed.
ISBN:9781467316354
1467316350
ISSN:2150-5934
2150-5942
DOI:10.1109/IMPACT.2012.6420285