Copper direct bonding for 3D integration

In 3D integration circuits, metal bonding is a key stage for stacking wafers. In this contribution, the direct Cu/Cu bonding at atmospheric pressure is investigated. At room temperature, a 2.8 J/m 2 bonding toughness is achieved without copper oxide at the interface. The vertical current of this bon...

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Published in2008 International Interconnect Technology Conference pp. 61 - 63
Main Authors Gueguen, Pierric, di Cioccio, Lea, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Charvet, Anne Marie, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2008
Subjects
Bonding
Copper
Decision support systems
Quadratic programming
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Abstract In 3D integration circuits, metal bonding is a key stage for stacking wafers. In this contribution, the direct Cu/Cu bonding at atmospheric pressure is investigated. At room temperature, a 2.8 J/m 2 bonding toughness is achieved without copper oxide at the interface. The vertical current of this bonding and the possibility to grind the top silicon down to 10 μm have been demonstrated.
AbstractList In 3D integration circuits, metal bonding is a key stage for stacking wafers. In this contribution, the direct Cu/Cu bonding at atmospheric pressure is investigated. At room temperature, a 2.8 J/m 2 bonding toughness is achieved without copper oxide at the interface. The vertical current of this bonding and the possibility to grind the top silicon down to 10 μm have been demonstrated.
Author di Cioccio, Lea
Clavelier, Laurent
Scevola, Daniel
Charvet, Anne Marie
Zussy, Marc
Lafond, Dominique
Gueguen, Pierric
Bally, Laurent
Rivoire, Maurice
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  organization: CEA Léti - MINATEC, 17 rue des Martyrs, F-38054 Grenoble Cedex 9, France
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Snippet In 3D integration circuits, metal bonding is a key stage for stacking wafers. In this contribution, the direct Cu/Cu bonding at atmospheric pressure is...
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StartPage 61
SubjectTerms Bonding
Copper
Decision support systems
Quadratic programming
Title Copper direct bonding for 3D integration
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