Thermal load boards - another thermal management design tool

This paper describes a tool that can be used in the thermal management design of electronic printed circuit assemblies at both the board level and the system level. The thermal load board tool simulates actual thermal conditions that can be easily modeled and validated. The approach described herein...

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Bibliographic Details
Published in2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium pp. 65 - 69
Main Author Siegal, B.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.03.2009
Subjects
Application software
Assembly systems
bare die simulation
Circuit simulation
Electronic packaging thermal management
heat spreader
package simulation
Principal component analysis
printed circuit assembly (PCA)
Printed circuits
simulation validation
Thermal engineering
Thermal Load Board (TLB)
Thermal loading
Thermal management
thermal management design
Thermal management of electronics
thermal simulation
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Summary:This paper describes a tool that can be used in the thermal management design of electronic printed circuit assemblies at both the board level and the system level. The thermal load board tool simulates actual thermal conditions that can be easily modeled and validated. The approach described herein is useful in minimizing electronic system development time and cost.
ISBN:1424436648
9781424436644
ISSN:1065-2221
2577-1000
DOI:10.1109/STHERM.2009.4810744