Power-CAD: A novel methodology for design, analysis and optimization of Power Electronic Module layouts

• Published in: 2010 IEEE Energy Conversion Congress and Exposition pp. 2692 - 2699
• Main Authors: Hingora, Naveed, Xiangyu Liu, Yongfeng Feng, McPherson, Brice, Mantooth, Alan
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.09.2010
• Subjects: computer-aided design (CAD); design automation; electronic packaging; Electronic packaging thermal management; electrothermal analysis; Integrated circuit modeling; Mathematical model; Optimization; optimization methods; power electronic modules (PEM); Power electronics; Solid modeling; Thermal analysis
• ISBN: 1424452864; 9781424452866
• ISSN: 2329-3721
• DOI: 10.1109/ECCE.2010.5618043

Power Electronic Module (PEM) design requires simultaneous analysis of thermal, electrical, and mechanical parameters to design an optimal layout. The current design process being used by package designers involves a sequential procedure instead of a simultaneous process. Each design step involves the analysis of the thermal, electrical or mechanical aspects of the design. As a result, the designer has to iterate between the various design process steps in order to achieve an optimal design. This causes a substantial increase in the design cycle time. A new methodology has been developed and implemented in this work that helps to automate and optimize the PEM design process. Power-CAD uses an electrothermal simulation methodology, a parasitic extraction tool, and an optimization algorithm that helps to achieve an optimal layout for a discrete PEM. This approach promises to save time and money for the PEM design industry by significantly reducing the number of design cycles.