APA (7th ed.) Citation

Hu, B., Cai, C., Xie, D., & Wu, B. (2010, August). Failure strength study of silicon die and LCD glass by FEA and experiment. 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, 217-219. https://doi.org/10.1109/ICEPT.2010.5582440

Chicago Style (17th ed.) Citation

Hu, Billy, Charles Cai, Dongji Xie, and Boyi Wu. "Failure Strength Study of Silicon Die and LCD Glass by FEA and Experiment." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging Aug. 2010: 217-219. https://doi.org/10.1109/ICEPT.2010.5582440.

MLA (9th ed.) Citation

Hu, Billy, et al. "Failure Strength Study of Silicon Die and LCD Glass by FEA and Experiment." 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, Aug. 2010, pp. 217-219, https://doi.org/10.1109/ICEPT.2010.5582440.