Failure strength study of silicon die and LCD glass by FEA and experiment

Measurement of failure strength of brittle material is always a challenge. Silicon die and LCD glass are two major brittle components in electronic products. Both of them may fail when subject to a large stress during manufacturing, assembling and in field. In order to assess the risk of failure, bo...

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Bibliographic Details
Published in2010 11th International Conference on Electronic Packaging Technology and High Density Packaging pp. 217 - 219
Main Authors Hu, Billy, Cai, Charles, Dongji Xie, Boyi Wu
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2010
Subjects
3-point bending (3PB)
ball on ring (BOR)
Equations
Glass
LCD glass
Mathematical model
Silicon
silicon die
strength
Stress
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ISBN9781424481408
1424481406
DOI10.1109/ICEPT.2010.5582440

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Summary:Measurement of failure strength of brittle material is always a challenge. Silicon die and LCD glass are two major brittle components in electronic products. Both of them may fail when subject to a large stress during manufacturing, assembling and in field. In order to assess the risk of failure, both 3-point bending (3PB) and ball-on-ring (BOR) are employed to measure the flexural strength of silicon die and glass in this paper. The samples are taken from actual consumer digital products. It is found that the results from two different testing methods are quite different, which include the values of strength and the failure modes. The failure mechanism and location are also studied using finite element analysis (FEA). Two different cracking modes come out of the test results for both silicon die and LCD glass. One is cracking into many small pieces and this is the main cracking mode. The other is cracking into two half.
ISBN:9781424481408
1424481406
DOI:10.1109/ICEPT.2010.5582440