Programmable Micro-Object Assembly with Transfer

A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, aut...

Full description

Saved in:
Bibliographic Details
Published in2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) pp. 390 - 393
Main Authors Plochowietz, Anne, Wang, Yunda, Shreve, Matthew, Crawford, Lara S., Raychaudhuri, Sourobh, Butylkov, Sergey, Rupp, Bradley B., Wang, Qian, Wang, Yu, Kalb, Jamie, Lu, Jeng P., Chow, Eugene M.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2019
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 μm) and silicon chips (150 μm). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 μm registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems.
ISSN:2167-0021
DOI:10.1109/TRANSDUCERS.2019.8808800