Programmable Micro-Object Assembly with Transfer
A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, aut...
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Published in | 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) pp. 390 - 393 |
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Main Authors | , , , , , , , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.06.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 μm) and silicon chips (150 μm). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 μm registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems. |
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ISSN: | 2167-0021 |
DOI: | 10.1109/TRANSDUCERS.2019.8808800 |