Influence of Grain Refinement on Direct Bonding for Electrodeposited Copper

This study aims to investigate microstructural effect on direct Cu bonding. Electro-deposited Cu samples with different grain sizes, preferred orientations as well as hardnesses were prepared. The influence of individual factors will be studied especially grain size. Experimental results show that t...

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Bibliographic Details
Published in2019 International Conference on Electronics Packaging (ICEP) pp. 216 - 219
Main Authors Xie, Zong-Yu, Yu, I-You, Song, Jenn-Ming, Tarng, David, Hung, Chih-Pin
Format Conference Proceeding
LanguageEnglish
Published Japan Institute of Electronics Packaging 01.04.2019
Subjects
Bonding
Copper
Electrodeposited Copper
Grain boundaries
Grain size
nanotwin
Plasma temperature
X-ray scattering
Xenon Flash
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Summary:This study aims to investigate microstructural effect on direct Cu bonding. Electro-deposited Cu samples with different grain sizes, preferred orientations as well as hardnesses were prepared. The influence of individual factors will be studied especially grain size. Experimental results show that through grain refinement the strength of directly-bonded electroplated copper joints can be effectively increased by 30%.
DOI:10.23919/ICEP.2019.8733455