Package-to-board transition via parasitic effects on simultaneous switching noise

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Bibliographic Details
Published in2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006 Vol. 3; pp. 756 - 759
Main Authors Xin Wu, Schicht, S.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2006
Subjects
Analytical models
Circuit noise
Circuit simulation
Driver circuits
Equivalent circuits
Integrated circuit interconnections
Integrated circuit packaging
Power system modeling
Switches
Voltage
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ISBN:9781424402939
142440293X
ISSN:2158-110X
2158-1118
DOI:10.1109/ISEMC.2006.1706411