Thermal Analysis of Novel Helix TWTs
Consider the thermal contact resistance and the thermal conductivity as the function of temperature, the power dissipation of BeO and diamond-supported, the diamond-studded and the full-diamond helical slow-wave structures (HSWS) are computed using ANSYS. Results indicated the studded-diamond circui...
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Published in | 2006 IEEE International Vacuum Electronics Conference held Jointly with 2006 IEEE International Vacuum Electron Sources pp. 139 - 140 |
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Main Authors | , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
2006
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Subjects | |
Online Access | Get full text |
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Summary: | Consider the thermal contact resistance and the thermal conductivity as the function of temperature, the power dissipation of BeO and diamond-supported, the diamond-studded and the full-diamond helical slow-wave structures (HSWS) are computed using ANSYS. Results indicated the studded-diamond circuit is better than the diamond-support circuit. Especially, the full diamond circuit demonstrated advantage of excellent heat removing |
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ISBN: | 9781424401086 1424401089 |
DOI: | 10.1109/IVELEC.2006.1666223 |