Thermal Analysis of Novel Helix TWTs

Consider the thermal contact resistance and the thermal conductivity as the function of temperature, the power dissipation of BeO and diamond-supported, the diamond-studded and the full-diamond helical slow-wave structures (HSWS) are computed using ANSYS. Results indicated the studded-diamond circui...

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Bibliographic Details
Published in2006 IEEE International Vacuum Electronics Conference held Jointly with 2006 IEEE International Vacuum Electron Sources pp. 139 - 140
Main Authors LieMing Yao, ZhongHai Yang, Bin Li, Li Liao, BaoQing Zeng, XiaoFang Zhu
Format Conference Proceeding
LanguageEnglish
Published IEEE 2006
Subjects
ANSYS
Circuit testing
Computational modeling
Conducting materials
Contact resistance
Copper
diamond
Electrical resistance measurement
Power dissipation
Temperature measurement
Thermal conductivity
thermal contact resistance
Thermal resistance
TWT
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Summary:Consider the thermal contact resistance and the thermal conductivity as the function of temperature, the power dissipation of BeO and diamond-supported, the diamond-studded and the full-diamond helical slow-wave structures (HSWS) are computed using ANSYS. Results indicated the studded-diamond circuit is better than the diamond-support circuit. Especially, the full diamond circuit demonstrated advantage of excellent heat removing
ISBN:9781424401086
1424401089
DOI:10.1109/IVELEC.2006.1666223