Morpack Cube: A portable 3D heterogeneous system integration platform

This paper proposes a portable three-dimensional (3D) heterogeneous system integration platform with reusable sockets, namely, morphing package Cube (MorPACK Cube). The architecture of MorPACK Cube platform achieves the features of miniaturization and portability without a carrier board. Our propose...

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Bibliographic Details
Published in2013 IEEE International SOC Conference pp. 197 - 202
Main Authors Chun-Chieh Chiu, Chih-Hsing Lin, Chih-Chyau Yang, Yi-Jun Liu, Ssu-Ying Chen, Jin-Ju Chue, Chih-Ting Kuo, Gang-Neng Sung, Chun-Pin Lin, Chien-Ming Wu, Chun-Ming Huang
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2013
Subjects
3D Heterogeneous Integrated Platform
Bluetooth
Compass
Computer architecture
Field programmable gate arrays
Mor-PACK
SDRAM
Sensor
Software
Substrates
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Summary:This paper proposes a portable three-dimensional (3D) heterogeneous system integration platform with reusable sockets, namely, morphing package Cube (MorPACK Cube). The architecture of MorPACK Cube platform achieves the features of miniaturization and portability without a carrier board. Our proposed MorPACK Cube integrates accelerometer sensor, gyroscope sensor and electronic compasses sensor and then exhibits on Andriod platform through Bluetooth wireless communication. Furthermore, we develop an Mobile APP, namely SigView, to display and analysis the collected data from these sensors. The proposed MorPACK Cube is used for sensor applications to demonstrate the effectiveness, compared with the total area 434cm 2 obtained by implementing MorPACK Cube platform with a carrier board, the results show that there are 91.14% area cost reduced by the MorPACK Cube platform without a carrier board. Besides, around 60% performance improvement of operation frequency can be benefited from the 3D-stacking technique.
ISSN:2164-1676
2164-1706
DOI:10.1109/SOCC.2013.6749687