Challenges of chip-to-package interaction for 22nm technology with ultra low k and Pb-free interconnects

A review of the chip-to-package interaction (CPI) results during the development and qualification of IBM's 22SOI high performance technology will be presented. Initial results and failure modes using ultra low-k (ULK) dielectric BEOL during the early development phase are shown. The fail modes...

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Bibliographic Details
Published in2013 IEEE 63rd Electronic Components and Technology Conference pp. 402 - 405
Main Authors Muzzy, Chris, Bisson, Richard, Cincotta, John, Degraw, Danielle, Engbrecht, Edward, Gill, Jason, Lustig, Naftali, McLaughlin, Karen, Ouimet, Sylvain, Ross, Joseph, Turnbull, David
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2013
Subjects
Assembly
Dielectrics
Materials
Moisture
Reliability
Stress
Vehicles
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Summary:A review of the chip-to-package interaction (CPI) results during the development and qualification of IBM's 22SOI high performance technology will be presented. Initial results and failure modes using ultra low-k (ULK) dielectric BEOL during the early development phase are shown. The fail modes include BEOL cracking under solder pads due to ULK formulations, from both planned material formulations and material properties related to tool excursion events, and leakage failures under high temperature, bias, and moisture attributed to incomplete formation of die edge seal. Full qualification data on a final robust process showing excellent CPI performance for this technology node are presented.
ISBN:9781479902330
1479902330
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2013.6575602