Metal-Transfer-Micromolded RF Components for System-On-Package (SOP)

This paper reports a metal-transfer-micromolding (MTM) technique for simultaneous implementation of metallized high aspect ratio molded polymer RF passive components, as well as an organic RF circuit board, in a high performance and cost-effective fashion. A system on package (SOP) integration schem...

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Bibliographic Details
Published in2007 Proceedings 57th Electronic Components and Technology Conference pp. 1877 - 1883
Main Authors Yanzhu Zhao, Yong-Kyu Yoon, Allen, M.G.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2007
Subjects
Band pass filters
Circuit testing
Coplanar waveguides
Metallization
Packaging
Planar waveguides
Polymers
Printed circuits
Radio frequency
Vehicles
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Summary:This paper reports a metal-transfer-micromolding (MTM) technique for simultaneous implementation of metallized high aspect ratio molded polymer RF passive components, as well as an organic RF circuit board, in a high performance and cost-effective fashion. A system on package (SOP) integration scheme of air lifted RF components can be realized by this process. Two test vehicles have been utilized to demonstrate the feasibility of the proposed process: planar coplanar waveguide (CPW)-based band stop filters and an airlifted monopole antenna array, both operating in Ka-band. The measured filter characteristic shows a loss of less than 2.5 dB in passband and 20 dB in stopband, which agrees well with HFSS10.0 simulations. The monopole antennas show good radiation performance and the 10 dB bandwidths at the resonant radiation frequencies are as large as 21.5% for the tested structures.
ISBN:9781424409846
1424409845
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2007.374054