Defect Z-depth Determination in Flip-chip using lock-in thermography

This paper describes the use of Lock-In Thermography (LIT) technique to determine the defect Z-depth in flip chip. An empirical phase shift versus applied lock-in frequency plot for Flip-chip is first created by using samples with known defect Z-depth. The actual experimental phase shift data from r...

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Bibliographic Details
Published in2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) pp. 1 - 4
Main Authors Wen Qiu, Zee, Bemice, Deslandes, Herve, Lai, Brian, Tien, David
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.07.2017
Subjects
Cameras
Failure analysis
Flip-chip devices
Frequency measurement
Phase measurement
Pins
Semiconductor device measurement
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Summary:This paper describes the use of Lock-In Thermography (LIT) technique to determine the defect Z-depth in flip chip. An empirical phase shift versus applied lock-in frequency plot for Flip-chip is first created by using samples with known defect Z-depth. The actual experimental phase shift data from reject samples with unknown defect locations are then measured and compared against the empirical phase shift plot. The defect Z-depth of these samples are determined by comparing where the experimental phase shift data points lies with respect to empirical phase shift plot and validated with Physical Failure Analysis (PFA).
ISSN:1946-1550
DOI:10.1109/IPFA.2017.8060110