Three-Dimensional Transient Interconnect Analysis With Regard to Mechanical Stress

We presented a transient electro-thermal analysis with STAP considering self-heating. Thermo-mechanical simulators, e.g. FEDOS, are coupled to provide appropriated input data for electromigration analysis to obtain predictive results. The presented electro-thermal results depict the high temperature...

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Bibliographic Details
Published in2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits pp. 154 - 157
Main Authors Holzer, S., Hollauer, C., Ceric, H., Karner, M., Grasser, T., Langer, E., Selberherr, S.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.07.2006
Subjects
Conducting materials
Electromigration
Equations
Microelectronics
Temperature distribution
Thermal conductivity
Thermal expansion
Thermal stresses
Thermomechanical processes
Transient analysis
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Summary:We presented a transient electro-thermal analysis with STAP considering self-heating. Thermo-mechanical simulators, e.g. FEDOS, are coupled to provide appropriated input data for electromigration analysis to obtain predictive results. The presented electro-thermal results depict the high temperature gradients close to heat sources and heat sinks. Further regions of high risk of electromigration are presented as results of thermo-mechanical simulations. The vias as well as edges and corners of interconnects in general are highly stressed regions due to the mismatch of thermal volume expansion coefficients and due to weak material adhesion of material interfaces
ISBN:1424402050
9781424402052
ISSN:1946-1542
1946-1550
DOI:10.1109/IPFA.2006.251019