Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal

Among the technological developments pushed by the emergence of 3D-ICs, wafer thinning has become a key element in device processing over the past years. As technology matures, more emphasis is now being put on the overall cost of ownership, which is still regarded as a refraining element for techno...

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Published in2015 IEEE 65th Electronic Components and Technology Conference (ECTC) pp. 1430 - 1435
Main Authors Phommahaxay, Alain, Nakamura, Atsushi, Jourdain, Anne, Verbinnen, Greet, Kamochi, Yoshitaka, Koyama, Ichiro, Iwai, Yu, Sawano, Mitsuru, Tan, Shiro, Miller, A., Beyer, Gerald, Sleeckx, E., Beyne, Eric
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2015
Subjects
Bonding
Chemicals
Inspection
Silicon
Solvents
Substrates
Surfaces
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Summary:Among the technological developments pushed by the emergence of 3D-ICs, wafer thinning has become a key element in device processing over the past years. As technology matures, more emphasis is now being put on the overall cost of ownership, which is still regarded as a refraining element for technology adoption. Therefore novel temporary bond concepts and materials are being explored to further bring down the process complexity and cost.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2015.7159785