Microwave heating for accelerated fabrication of parquet

This paper presents a new microwave accelerated process for adhesion of parquet Parquet consists of two or three layers of wood, sticked together with glue. By using microwaves it is possible to heat the glue directly such that the curing time for the glue can be reduced, resulting in a shorter cycl...

Full description

Saved in:
Bibliographic Details
Published in33rd European Microwave Conference Proceedings (IEEE Cat. No.03EX723C) Vol. 3; pp. 1333 - 1336 Vol.3
Main Authors Kayser, T., Sorgel, W., von Hagen, J., Wiesbeck, W.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2003
Subjects
Acceleration
Attenuation
Curing
Dielectric materials
Dielectric measurements
Electromagnetic heating
Fabrication
Frequency
Permittivity measurement
Thermal conductivity
Online AccessGet full text

Cover

More Information
Summary:This paper presents a new microwave accelerated process for adhesion of parquet Parquet consists of two or three layers of wood, sticked together with glue. By using microwaves it is possible to heat the glue directly such that the curing time for the glue can be reduced, resulting in a shorter cycle time and higher productivity. To optimise the process one needs to know the properties of involved materials. This paper shows, that the combination of wood and glue is ideal for microwave processing. To verify the capability for industrial processes, results of heating experiments at 2.45 GHz with a real microwave adapted parquet press are presented.
ISBN:9781580538343
1580538347
DOI:10.1109/EUMC.2003.177733