IXE 7000 Ethernet switch package development

The IXE74242 is a device in the IXE 7000 product line targeted for high performance Layer 2/3/4 Ethernet communication switching with 24 /spl times/ 1G b/s and 2 /spl times/ 10 Gb/s ports. It is Intel Communication Group ESO division's first 90 nm switch built in a 42.5 mm flip chip package. Th...

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Bibliographic Details
Published inProceedings Electronic Components and Technology, 2005. ECTC '05 pp. 1 - 8 Vol. 1
Main Authors Mathew, R., Hasan, A., Liyu Yang, Chi-te Chen, Tran, H., Abhyankar, R.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2005
Subjects
Communication switching
Ethernet networks
Flip chip
Network servers
Packaging
Routing
Signal design
Silicon
Stacking
Switches
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Summary:The IXE74242 is a device in the IXE 7000 product line targeted for high performance Layer 2/3/4 Ethernet communication switching with 24 /spl times/ 1G b/s and 2 /spl times/ 10 Gb/s ports. It is Intel Communication Group ESO division's first 90 nm switch built in a 42.5 mm flip chip package. This paper describes the IXE74242 product and package development challenges in developing successful first working silicon on Intel's 90 nm mixed signal silicon platform.
ISBN:0780389077
9780780389076
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2005.1441236