Ultra high Q embedded inductors in highly miniaturized family of low loss organic substrates

This paper presents the design, fabrication and measurement of high Q miniaturized inductors on a new family of ultra thin organic substrates. This paper for the first time discusses the design and fabrication of embedding ultra miniaturized RF inductors in ultra thin (100 - 150 microns thickness) o...

Full description

Saved in:
Bibliographic Details
Published in2008 58th Electronic Components and Technology Conference pp. 2073 - 2080
Main Authors Athreya, D., Sundaram, V., Iyer, M., Tummala, R.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2008
Subjects
Dielectric constant
Dielectric losses
Dielectric substrates
Fabrication
Inductors
Laminates
Q measurement
Radio frequency
Testing
Vehicles
Online AccessGet full text

Cover

More Information
Summary:This paper presents the design, fabrication and measurement of high Q miniaturized inductors on a new family of ultra thin organic substrates. This paper for the first time discusses the design and fabrication of embedding ultra miniaturized RF inductors in ultra thin (100 - 150 microns thickness) organic substrates. The substrate described in this paper belongs to a new family of ultra low profile organic laminates with a loss tangent of about 0.0034 - 0.0045 and a dielectric constant of 3.4. Innovative inductor designs on this ultra thin substrate resulted in unloaded quality factors of about 100 - 150 in the frequency range of 1- 15 GHz and have line widths in the range of 2 - 4 mils and occupying an area of 0.062 - 0.64 mm 2 . Design optimization, modeling and simulations performed are discussed in detail. Two test vehicles - test vehicle 1 (TV1) made up of two metal layers, having a thickness of 100 microns and test vehicle 2 (TV2), consisting of four metal layers and 150 microns in thickness have been used for the design of these inductors.
ISBN:9781424422302
1424422302
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2008.4550270