A Close Look on Voids in Solder Joints

A challenge for the power electronics industry is the reliability of solder joints [1] for automotive application due to the increasing performance requirements, especially in handling thermal and electrical environments. A known fact is that the presence of voids in the solder joints adversely affe...

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Bibliographic Details
Published in2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) pp. 1 - 5
Main Authors Fladischer, Katrin, Mitterhuber, Lisa, Kraker, Elke, Ginter, Daniel, Rosc, Jordis, Magnien, Julien
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2018
Subjects
Conductivity
Heating systems
MOSFET
Soldering
Thermal conductivity
Thermal resistance
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Summary:A challenge for the power electronics industry is the reliability of solder joints [1] for automotive application due to the increasing performance requirements, especially in handling thermal and electrical environments. A known fact is that the presence of voids in the solder joints adversely affects thermal resistance due to decreased heat dissipation and a reduction of the cross-sectional area, which can lead to reliability effects [2]. In this work, the influence of different voids scenarios in solder joints via finite volume simulation on the example of a commercially available MOSFET was studied. Finite volume simulations (FloTHERM Ⓡ) provide thermal transients that can be transferred into their corresponding structure function [3], [4]. Thus, changes in the heat path and the corresponding thermal resistance can be evaluated and interpreted. This work shows that voids implemented as random distributed, internal voids inside the solder joint can be correlated to the common approach of effective thermal conductivity [5].
ISSN:2474-1523
DOI:10.1109/THERMINIC.2018.8593311