Impact of clock net routing on EMC emissions performance of automotive electronic modules

Modern automotive electronic products with highspeed digital interfaces pose design challenges in the areas of signal integrity (SI) and electromagnetic compatibility (EMC). On one hand, the manufacturer must comply with legal and industry specific EMC requirements and on the other hand, the product...

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Bibliographic Details
Published in2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) pp. 513 - 518
Main Authors Filipov, S., Hadzhikrasteva, A., Nandyala, C., Mee, S., Russa, K., Lutz, A.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2014
Subjects
clock traces
Clocks
Electromagnetic compatibility
EMC
emissions
high-speed digital interface
Impedance
Microstrip
rise-time
Routing
signal integrity
Silicon
Topology
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Summary:Modern automotive electronic products with highspeed digital interfaces pose design challenges in the areas of signal integrity (SI) and electromagnetic compatibility (EMC). On one hand, the manufacturer must comply with legal and industry specific EMC requirements and on the other hand, the product is expected to function seamlessly over all environmental conditions and process tolerances. Numerous guidelines have been published on how to optimize the design performance in these two areas (EMC & SI) but few address the impact one can have on the other. This paper examines the impact several SI compliant routing patterns have on EMC emissions performance.
ISBN:9781479955442
1479955442
ISSN:2158-110X
2158-1118
DOI:10.1109/ISEMC.2014.6899026