Low COO PVD solutions addressing 2.5D and 3D TSV packaging challenges
As with any emerging technology, 2.5D and 3D IC TSV packaging integration brings new challenges. Amongst others, we will review thin wafer handling, organic passivation outgassing control, glue layers critical thermal management and TSV high aspect ratio barrier and seed layers deposition. We will t...
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Published in | 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) pp. 1 - 6 |
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Main Authors | , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.11.2012
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Online Access | Get full text |
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Summary: | As with any emerging technology, 2.5D and 3D IC TSV packaging integration brings new challenges. Amongst others, we will review thin wafer handling, organic passivation outgassing control, glue layers critical thermal management and TSV high aspect ratio barrier and seed layers deposition. We will then demonstrate how Oerlikon's PVD technology has managed to address each of these issues with manufacturing low COO solutions. |
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ISBN: | 9781467343848 1467343846 |
ISSN: | 1089-8190 2576-9626 |
DOI: | 10.1109/IEMT.2012.6521799 |