3-D electrothermal device/circuit simulation of DC-DC converter module in multi-die IC

Presented work introduces automated interaction of SDevice and HSPICE for fast 3-D electrothermal simulation. The proposed methodology maintains a very high accuracy of the modelled parameters in a wide range of dynamic temperature fluctuations, which brings the thermal simulations much closer to th...

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Bibliographic Details
Published in2014 44th European Solid State Device Research Conference (ESSDERC) pp. 130 - 133
Main Authors Chvala, Ales, Donoval, Daniel, Nagy, Lukas, Marek, Juraj, Pribytny, Patrik, Molnar, Marian
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2014
Subjects
3-D electrothermal simulation
Analytical models
HSPICE
Integrated circuit modeling
MOSFET
Multi-die IC DC-DC converter module
SDevice
Solid modeling
Temperature dependence
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Summary:Presented work introduces automated interaction of SDevice and HSPICE for fast 3-D electrothermal simulation. The proposed methodology maintains a very high accuracy of the modelled parameters in a wide range of dynamic temperature fluctuations, which brings the thermal simulations much closer to the real state. The designed electrothermal simulation is developed for Synopsys TCAD Sentaurus environment. The main goal is decreasing the simulation time for complex 3-D devices. A DC-DC converter module in a multi-die integrated circuit is used as an example to perform validation of the designed electrothermal simulation. The features and limitations of the method are analyzed and presented.
ISBN:9781479943784
1479943789
ISSN:1930-8876
DOI:10.1109/ESSDERC.2014.6948775