Enhancement of FIB Fault Isolation Analysis using Plasma Cleaning

Electron beam-induced contamination is one of the annoying problems in scanning electron microscopy (SEM) inspection process. When electron beam continuously scans the specimen surface, hydrocarbon molecules (from vacuum pump) in the chamber or on the specimen surface are broken down and adhered to...

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Bibliographic Details
Published in2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) pp. 1 - 5
Main Authors Yeoh, Lai-Seng, Ong, Huey-Lin, Chong, Kok-Cheng, Li, Susan
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.07.2018
Subjects
Cleaning
Inspection
Logic gates
Plasmas
Surface contamination
Surface treatment
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Summary:Electron beam-induced contamination is one of the annoying problems in scanning electron microscopy (SEM) inspection process. When electron beam continuously scans the specimen surface, hydrocarbon molecules (from vacuum pump) in the chamber or on the specimen surface are broken down and adhered to the specimen. This may alter or hidden away the structure of smaller feature in interest and causes it to be invisible. An effective way to confront with this contamination is using plasma cleaner to remove this undesirable residual.
ISSN:1946-1550
DOI:10.1109/IPFA.2018.8452605