Inspection of through silicon vias (TSV) and other interconnections in IC packages by computed tomography

Through silicon vias (TSV) as used in 3D integrated electronic packages were inspected non-destructively by highly resolving nanofocus computed tomography (nanoCT). In particular, in the TSVs plating voids were visualised and quantitatively evaluated by numerical processing of the resulting volumetr...

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Bibliographic Details
Published in2009 11th Electronics Packaging Technology Conference pp. 438 - 441
Main Authors Roth, H., Zhenhui He, Mayer, T.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2009
Subjects
Bonding
Computed tomography
Detectors
Electronics packaging
Inspection
Integrated circuit packaging
Laboratories
Silicon
Through-silicon vias
X-ray imaging
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Summary:Through silicon vias (TSV) as used in 3D integrated electronic packages were inspected non-destructively by highly resolving nanofocus computed tomography (nanoCT). In particular, in the TSVs plating voids were visualised and quantitatively evaluated by numerical processing of the resulting volumetric data. The nanoCT technology is outlined and further applications such as interposers etc. are considered.
ISBN:1424450993
9781424450992
DOI:10.1109/EPTC.2009.5416506