Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints

Saved in:
Bibliographic Details
Published inProceedings Electronic Components and Technology, 2005. ECTC '05 pp. 674 - 681
Main Authors Lehman, L.P., Kinyanjui, R.K., Wang, J., Xing, Y., Zavalij, L., Borgesen, P., Cotts, E.J.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2005
Subjects
Assembly
Degradation
Environmentally friendly manufacturing techniques
Intermetallic
Lead
Life estimation
Microstructure
Soldering
Switches
Testing
Online AccessGet full text

Cover

More Information
ISBN:0780389077
9780780389076
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2005.1441341