A novel buffer structure and lifetime control technique with Poly-Si for thin wafer diode

A novel buffer structure for improving the trade-off between forward voltage and reverse recovery loss across the whole range of current density and realizing the softness during reverse recovery was developed. The structure named a ldquoBroad Buffers from Double Sides structurerdquo (BBDS) is compo...

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Bibliographic Details
Published in2009 21st International Symposium on Power Semiconductor Devices & IC's pp. 140 - 143
Main Authors Fujii, H., Inoue, M., Hatade, K., Tomomatsu, Y.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2009
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Summary:A novel buffer structure for improving the trade-off between forward voltage and reverse recovery loss across the whole range of current density and realizing the softness during reverse recovery was developed. The structure named a ldquoBroad Buffers from Double Sides structurerdquo (BBDS) is composed a broad p- anode layer and a broad n- buffer layer. A novel technique called ldquoLocal Lifetime control technique with Poly-Si layerrdquo (LLP) was also developed. LLP controls the conductivity modulation level without introducing recombination centers in the n-layer. Combining these new techniques, namely, BBDS and LLP, made it possible, for the first time, to create a fast-recovery diode without the need to use conventional heavy-metal diffusion or irradiation methods.
ISBN:9781424435258
1424435250
ISSN:1063-6854
1946-0201
DOI:10.1109/ISPSD.2009.5158021